Union Minister Ashwini Vaishnaw Attends Launch of India’s First 3D Glass Chip Unit in Odisha; Big Boost to AI & 5G

Bhubaneswar, April 19: In a major push towards making India a global semiconductor hub, Odisha on Sunday laid the foundation stone for the country’s first Advanced 3D Glass Semiconductor Packaging Unit. The project, developed by Heterogenous Integration Packaging Solutions (3DGS), marks a significant milestone in India’s electronics manufacturing journey.

The groundbreaking ceremony was led by Chief Minister Mohan Charan Majhi in the presence of Union IT Minister Ashwini Vaishnaw and State IT Minister Mukesh Mahaling. Global industry leaders, including Lip-Bu Tan, also attended the event.

Calling it a landmark development, the Chief Minister said Odisha is emerging as a preferred destination for global investors due to its strong fundamentals, including infrastructure, skilled workforce, connectivity, and governance.

He added that the unit will cater to next-generation technologies such as Artificial Intelligence, high-performance computing, defence electronics, and telecommunications, aligning with Prime Minister Narendra Modi’s vision of self-reliance in semiconductor manufacturing.

The project involves an investment of around ₹2,000 crore and is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced modules. With this, Odisha becomes the only state in India to host both a compound semiconductor fabrication unit and an advanced chip packaging facility.

Union Minister Ashwini Vaishnaw said Odisha is rapidly transforming into a major technology hub, with multiple semiconductor projects already approved under the India Semiconductor Mission and more proposals in the pipeline. He also highlighted ongoing railway projects worth over ₹90,000 crore to strengthen connectivity across the state.

State IT Minister Mukesh Mahaling emphasized that Odisha’s IT, AI, and Semiconductor Policies 2025 will drive innovation, attract investments, and generate employment opportunities for engineers and skilled workers.

Praising the initiative, Intel CEO Lip-Bu Tan noted that Odisha’s speed of execution and clear vision make it a strong contender in the global semiconductor ecosystem.

With investments exceeding ₹10,000 crore across multiple semiconductor projects, Odisha is steadily transitioning from a resource-based economy to a technology-driven growth hub, reinforcing its role in India’s future-ready digital and manufacturing landscape.