Ashwini Vaishnaw News

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Ashwini Vaishnaw Launches New FM Transmitter in Jaisalmer to Boost Radio Connectivity in Border Areas

Jaisalmer, June 11: Union Minister Ashwini Vaishnaw on Thursday inaugurated a new 20 kW Akashvani FM transmitter at Ramgarh in Rajasthan’s Jaisalmer district, strengthening radio broadcasting services in India’s western border region. The inauguration was conducted virtually from Akashvani Jaipur. The project is expected to significantly improve access to information, education and entertainment for residents […]

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60 New Metro Rakes to Modernise Kolkata Metro Network: Ashwini Vaishnaw

New Delhi : In a meeting at the State Secretariat Nabanna today, Union Minister for Railways, Ashwini Vaishnaw announced the induction of 60 new-generation Metro rakes to modernise the Kolkata Metro network over the next four-five years. He highlighted the rapid expansion of Kolkata Metro, noting that 45 km of lines have been added in […]

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Union Minister Ashwini Vaishnaw Chairs High-Level Meeting on Revamp of AI Curriculum

New Delhi, May 28, 2026: Union Minister for Electronics and Information Technology Ashwini Vaishnaw chaired a high-level meeting with the AI Curriculum Taskforce in New Delhi to discuss a comprehensive revamp of India’s Artificial Intelligence curriculum aimed at aligning education with emerging technological trends and industry requirements. The initiative is part of the Government of […]

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Railway Minister Ashwini Vaishnaw Announces ₹962 Crore Kiul-Jhajha Rail Expansion Project

New Delhi, May 19, 2026: In a major boost to railway infrastructure and connectivity, the Ministry of Railways has approved the construction of a 54-kilometre third railway line between Kiul and Jhajha at an estimated cost of ₹962 crore. The project aims to enhance operational efficiency and reduce congestion on the highly busy Howrah-Delhi rail […]

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Ashwini Vaishnaw Launches ₹400 Crore Industrial Push with Semiconductor Facility Boost

New Delhi May 15 2026: Union Minister Ashwini Vaishnaw virtually laid the foundation stone for a new Sahasra Semiconductor manufacturing facility as part of a broader industrial development package worth over ₹400 crore, reinforcing India’s push toward advanced manufacturing and technology driven growth. The launch forms part of multiple industrial initiatives aimed at strengthening domestic […]

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Prasoon Joshi Named New Chief of Prasar Bharati, Government Signals Creative Push in Public Broadcasting

New Delhi, May 2, 2026: In a significant move aimed at strengthening India’s public broadcasting ecosystem, the Ministry of Information and Broadcasting has announced the appointment of celebrated lyricist and communication strategist Prasoon Joshi as the Chairman of Prasar Bharati. Joshi, widely regarded for his powerful storytelling and deep understanding of Indian culture, brings decades […]

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Ashwini Vaishnaw Flags Off Expanded 20 Coach Jammu Srinagar Vande Bharat, Boosting Kashmir Rail Connectivity

Jammu, April 30, 2026: Union Railway Minister Ashwini Vaishnaw flagged off the upgraded 20 coach Jammu Srinagar Vande Bharat Express from Jammu Railway Station, marking a major milestone in the expansion of rail infrastructure and regional connectivity in Jammu and Kashmir. The enhanced service, expanded from its earlier 8 coach capacity, is expected to significantly […]

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Ashwini Vaishnaw to Flag Off Extended Srinagar Jammu Vande Bharat as Rail Connectivity in J&K Gets Major Boost

New Delhi, April 29, 2026: Railway Minister Ashwini Vaishnaw will flag off the extended Srinagar Jammu Vande Bharat Express from Jammu Tawi Railway Station on April 30, marking a significant expansion of high speed rail connectivity in Jammu and Kashmir. The upgraded service, which previously operated between Srinagar and Shri Mata Vaishno Devi Katra, will […]

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Union Minister Ashwini Vaishnaw Attends Launch of India’s First 3D Glass Chip Unit in Odisha; Big Boost to AI & 5G

Bhubaneswar, April 19: In a major push towards making India a global semiconductor hub, Odisha on Sunday laid the foundation stone for the country’s first Advanced 3D Glass Semiconductor Packaging Unit. The project, developed by Heterogenous Integration Packaging Solutions (3DGS), marks a significant milestone in India’s electronics manufacturing journey. The groundbreaking ceremony was led by […]

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India’s first advanced 3D semiconductor packaging unit launched in Odisha; major push for AI, 5G and defence electronics

Bhubaneswar, April 19, 2026: The foundation stone for India’s first advanced 3D semiconductor packaging unit was laid at Info Valley in Bhubaneswar, marking a major milestone in the country’s semiconductor and electronics manufacturing journey and strengthening Odisha’s position as an emerging technology hub. The project, promoted by 3D Glass Solutions through its Indian subsidiary Heterogeneous […]

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