Bhubaneswar, April 19: In a major push towards making India a global semiconductor hub, Odisha on Sunday laid the foundation stone for the country’s first Advanced 3D Glass Semiconductor Packaging Unit. The project, developed by Heterogenous Integration Packaging Solutions (3DGS),…
Bhubaneswar, April 19, 2026: The foundation stone for India’s first advanced 3D semiconductor packaging unit was laid at Info Valley in Bhubaneswar, marking a major milestone in the country’s semiconductor…
Faridabad, April 19, 2026: Assistant Commissioner of Police Crime and Headquarters Faridabad Aman Yadav extended strong support to a nationwide awareness initiative led by preventive health expert Dr Bala, aimed…
