Bhubaneswar, April 19, 2026: Union Minister for Railways, Information and Broadcasting, and Electronics and Information Technology Ashwini Vaishnaw described the foundation of the 3D Glass Solutions semiconductor unit in Odisha as a landmark moment, highlighting its importance for India’s growing presence in advanced electronics manufacturing.
Speaking during the foundation ceremony, the minister said the project represents a major step in strengthening India’s semiconductor ecosystem while positioning Odisha as a fast developing centre for information technology and innovation.
The upcoming facility, being set up in Bhubaneswar, will introduce advanced glass based semiconductor packaging technology in the country for the first time. The unit is expected to play a crucial role in next generation applications such as artificial intelligence, telecommunications, defence systems and high performance computing.
Officials noted that the project involves an investment of around Rs 1,943 crore and is likely to generate nearly 2,500 employment opportunities, both direct and indirect, while supporting the development of a broader technology ecosystem in the region.
The initiative is part of a larger national push to build domestic semiconductor capabilities and reduce dependence on imports. With multiple projects underway, India aims to establish itself as a key player in the global chip manufacturing and design value chain.
The minister emphasised that such high technology investments are accelerating industrial transformation in Odisha, helping the state transition into a major hub for electronics and digital infrastructure in the coming years.
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