The Impressive TimesNew Delhi, August 12 — The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM) with a combined investment of approximately ₹4,600 crore. These projects, to be set up in Odisha, Punjab, and Andhra Pradesh, are expected to generate employment for 2,034 skilled professionals and spur a large number of indirect jobs, strengthening India’s electronics manufacturing ecosystem.
The latest approvals have been granted to SiCSem, 3D Glass Solutions Inc., Continental Device India Pvt. Ltd. (CDIL), and Advanced System in Package (ASIP) Technologies. With these additions, the total number of projects approved under ISM has reached 10, representing cumulative investments of about ₹1.60 lakh crore across six states.
Projects by State:
Odisha:
SiCSem Pvt. Ltd., in collaboration with Clas-SiC Wafer Fab Ltd., UK, will establish India’s first commercial compound semiconductor fabrication facility in Info Valley, Bhubaneshwar. The plant will produce Silicon Carbide (SiC) devices with an annual capacity of 60,000 wafers and 96 million packaged units. The products will cater to sectors including defence, electric vehicles, railways, solar inverters, and data centres.
3D Glass Solutions Inc. will set up a vertically integrated advanced packaging and embedded glass substrate facility, also in Info Valley. The plant will manufacture glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules, with applications in defence, AI, RF and automotive, photonics, and high-performance computing.
Punjab:
Continental Device India Pvt. Ltd. will expand its discrete semiconductor manufacturing facility in Mohali, producing high-power devices such as MOSFETs, IGBTs, Schottky diodes, and transistors in both Silicon and Silicon Carbide. The brownfield expansion will have an annual capacity of 158.38 million units for applications in automotive electronics, renewable energy, power conversion, and communication infrastructure.
Andhra Pradesh:
Advanced System in Package (ASIP) Technologies, in collaboration with APACT Co. Ltd., South Korea, will establish a semiconductor packaging unit with an annual capacity of 96 million units for use in mobile phones, set-top boxes, automobiles, and other electronics.
The government highlighted that these projects will play a pivotal role in meeting the growing domestic and global demand for semiconductors across telecom, automotive, consumer electronics, data centres, and industrial sectors, while also advancing the vision of Atmanirbhar Bharat.
In addition to infrastructure investments, the ISM has supported talent development by extending design infrastructure to 278 academic institutions and 72 start-ups, benefiting over 60,000 students to date.
With today’s approvals, India takes a significant step towards establishing itself as a global hub for semiconductor manufacturing, covering advanced packaging technologies and high-value compound semiconductor production.
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